Compact-size Rugged System RSQ10 with Intel® Elkhart Lake family processor and Wireless Kit that expanded M.2 slots for 5G and Wi-Fi communications
| Mechanical | |
|---|---|
| Dimension | 100(mm)x100(mm)x56.5(mm) |
| Weight | 0.56kg |
| Housing | Aluminum housing |
| Moumting type | Wallmount and Dinrail |
| Cooling | Fanless, cooling with heatsink |
| IP | IP30 |
| General | |
| CPU | Intel® Atom® x6413E, 4 cores, 3.0GHz/1.5 GHz, 9W TDP |
| Storage | eMMC 5.0 onboard flash 64GB up to 256 GB |
| Memory | On Board LPDDR4 up to 16GB, 3200 MT/s One memory channel, 64bit with In-Band ECC |
| Power Input | 9~36V |
| Indicator LED | Error :over heat (Red) / throttling (orange) EC ready : ready (green) / off power : S0 (green) / S3.S4.S5 (off) M.2 Storage : green / off |
| Operating Systems | Windows® 10 IoT Enterprise / Linux |
| Expansion | 1 x M.2 Key M 2242 (SATA) |
| Basic I/O Interface | |
| Power Connection | 1 x 3-pin screw-type terminal block |
| Ethernet | 2 x 2.5 GbE (Intel® i226) |
| USB | USB3.2 Gen2 x1 |
| Display | 1 x DP v1.4 4096 x 2160 @ 60Hz |
| Extend I/O Interface | |
| USB | USB3.2 Gen2 x1 |
| LED | 7 user define LED |
| Expansion | 1x M.2 E Key 2230 Wi‐Fi module,1x M.2 B Key 2242 PCIE storage or 3042/3052 cellular module,1xNano SIM slot. |
| Environment | |
| Operating Temperature | -20°C ~ 50 °C with airflow |
| Storage Temperature | -40 °C ~ 85 °C |
| Vibration | Wall mount- MIL-STD-810G 514.7C-V Category-4 / Din Rail – 1G (DIN EN 60068-2-6) |
| Shock | Wall mount – 40G (EN 60068-2-27)/ Din Rail – 15G (EN 60068-2-27) |
| Certification | CE, FCC |
