From SOM to SFF system

Knowledge sharing

SFF

In the Internet of Things (IoT) era, industrial computers are committed to applications such as smart cities, smart transportation, smart homes, and smart factories. Under the fast development of 5G and artificial intelligence (AI), IoT has been further promoted, which increase the demand of faster, smaller, and cheaper solutions. Depending on the advancement of component technologies, the design of today’s IPC systems can save more space using proper arrangement and eliminating redundant components to create a high-performance computing unit. This leads to Small Form Factor Computers (SFF) as the new generation of solution.

Agility, Integration, and Performance

With decades of experience in the industrial computer, Mitwell has strong capability on SOM product development, and furthermore, the SFF, which is the system integration of SOM. From the COMe module made by PICMG Association to Q7, SMARC, and OSM by SGet, they are the core computing engine of SFF flexible design development. Through different carrier board design, thousands of combinations are possible either on X86 or ARM platform to show great performance.

Compact Size; Excellent Performance

If the size is not “small” enough, it can’t be called SFF! Through creative thinking and excellent manufacturing technology, Mitwell continues to break through the limits of system design. Using the SOM architecture and Q7/SMARC form factors, the size of Mitwell’s SFF System can be designed under 10x 10cm, and the height can be under 1U. This compact-sized system save more space for the working environment. In addition, equipped with Intel Atom series up to Quad Core processor, it guarantees the best performance of different applications in various fields.

Cable free; Efficient Heat Dissipation

The smaller the system, the greater the difficulty to manage heat dissipation. The SFF system usually operates under industrial environment for a long time, which is inevitable to meet the problem of rising temperature. Through outstanding chassis design and powerful cooling fins, Mitwell’s SFF series greatly reduce the size and are able to control the temperature. No-cable design further ensures no hinder to the heat dissipation of any active components or block any airflow inside the chassis. It helps completing the work easily in an environment with a temperature range of -20~50 degrees.

Easy to Upgrade and Expansion

Due to the limited size of the SFF computer, the computing and IO elements need to be flexibly replaced to provide better performance. With SOM architecture, Mitwell’s SFF system can be easily upgraded by changing the module board instead of the whole system to the next generation with stronger computing capability. In response to the explosive growth of AIOT’s wired and wireless connections, the modular system is the best solution to customers. Mitwell’s SFF system series support HDMI 2.0 port (up to 3840×2160 60Hz output), DisplayPort 1.2 port (up to 4096×2160 60Hz output), and other connective options such as LTE/5G wireless LAN, USB 3.1, USB 2.0, and 2x Ethernet ports. Through the expansion of the carrier board, customers can easily change the interface function and meet the need of multi-point connection.

HDMI 2.0 port

DisplayPort 1.2 port

Ethernet ports

USB 3.1

USB 2.0

LTE/5Gwireless LAN

Flexibility of Din Rail Mounting and Wall Mounting

Although the traditional IPC can achieve high performance, the chassis is bulky and inconvenient to move and store, typically requiring a rack mount. In contrast to the traditional system, the SFF system is easy to move and suitable for edge computing. Besides, Mitwell’s SFF provides flexibility of Din Rail mounting and Wall mounting for storage, which can be placed vertically or horizontally to satisfy customers’ need in small fields or small cabinets.

Development trend of future computers

SFF computer owns powerful performance, at the same time, has the advantages of being mini, lightweight, and easy to expand. SFF computer has bidden farewell to the old image of high temperature, noise, and low performance. It shows a new look of quiet, powerful, and efficient heat dissipation. It is a new trend of future computer development!