ARIS-TU

Advanced Reliable Industry System

Features

  • Support Intel® Edge Controls for Industrial
  • Tiger Lake-UP3
  • Compact IPC
  • Fan-less Chassis
  • Time Sensitive Network
  • Wide Voltage DC Input
ARIS is compact IPC implemented rich I/O for industry fields. Those I/O including high-speed communication and low data rate connection. Rugged and reliable system design supports the applications of edge computing and industrial control. Intel TCC and TSN are the functions in use under industrial real-time networking.

Mechanical
Dimension 180(mm)x134(mm)x40(mm)
Weight 1.5kg
Housing Aluminum housing
Moumting type Wallmount and Dinrail
Cooling Fanless, cooling with heatsink
IP IP30
General
CPU Intel® Core i® processors -i3 1115GRE /i5 1145GRE/i7 1185GRE Tiger Lake-U processors 15W based on Type6 Compact COM EXPRESS module.
Storage 1x M.2 M Key 2280 NVMe (PCIe)
1x M.2 B Key 2242 SSD (SATA) (or 3042/3052 cellular module)
Memory SO-DIMM DDR4 up to 64GB, 3200 MT/s
Dual memory channels, 64bit with In-Band ECC
Power Input 9~36V
Indicator LED Error :over heat (Red)  / throttling (orange)
EC ready : ready (green) / off
power : S0 (green) / S3.S4.S5 (off)
M.2 Storage : green / off
Operating Systems Windows® 10 IoT Enterprise / Linux
Expansion 1 x M.2 Key M 2242 (SATA)
Basic I/O Interface
Power Connection 1 x 3-pin screw-type terminal block
Ethernet 2x 2.5 GbE (Intel® i226) and 1x 2.5 GbE (MaxLinear® GPY215)
USB 3x USB 3.2 and 3 USB 2.0
COM 4x COM ports, 8x digital inputs and 8x digital outputs
Display 2x DP v1.4 7680 x 4320 @ 60Hz
Expansion 1x M.2 E Key 2230 Wi-Fi module
1x M.2 B Key 3042/3052 cellular module (or 2242 SATA SSD)
1x Mini PCIe slot (PCIex1)
Environment
Operating Temperature  -25°C ~ 50 °C
Storage Temperature -40 °C ~ 85 °C
Vibration Wall mount-  MIL-STD-810G 514.7C-V Category-4 / Din Rail – 1G (DIN EN 60068-2-6)
Shock Wall mount – 40G (EN 60068-2-27)/ Din Rail – 15G (EN 60068-2-27)
Certification CE, FCC