MCM-M31

COM Express®Type 10 Module with Intel® Amston Lake family processor

Features

  • Intel® Astom™ x7000RE ® processor family
  • Support 24-bit LVDS, DP/DP++ output
  • Support Four PCI Express Gen3 lanes
  • Support two USB 3.0, eight USB 2.0
  • Options for eMMC 5.1 storage
The MCM-M31 is a compact COM Express® Type 10 module, measuring 84 x 55 mm, that leverages the power of the Intel Atom® Amston Lake x7000RE processor family. Built on this robust architecture, the MCM-M31 offers versatile display options with 24-bit LVDS and DP/DP++ outputs, along with high-speed data transfer capabilities through four PCI Express Gen3 lanes. Compliant with ACPI 5.0 power management standards, this module also supports a comprehensive range of I/O interfaces, including USB 3.0, USB 2.0, SATA, LPC, I2C, WDT, SPI, GPIO, fan control, and dual UARTs. Designed to meet the demands of various applications, such as automation, healthcare, retail, and transportation, the MCM-M31 offers a reliable and efficient solution for embedded systems.

 

General
CPUIntel® Atom® x7211RE, Dual cores, 6W TDP
Intel® Atom® x7213RE, Dual cores, 9W TDP
Intel® Atom® x7433RE, Quad cores, 9W TDP
Intel® Atom® x7835RE, Octa cores, 12W TDP
StorageSupport onboard eMMC 5.1 flash up to 256GB
MemoryOnboard 4G/ 8G/16G LPDDR5 with 4800 MT/s
Single memory channel, 32bit x 2
In Band-ECC (Intel® Atom® CPU)
Ethernet1x 2.5GbE with Intel® I226IT
DisplayPort Interface
DDIA24-bit Dual Channel LVDS up to 1920×1080@60Hz
DDIBDisplayPort / DP++ 1.4, up to 4K(4096×2304)@60Hz
AudioIntel® HD Audio integrated in SoC
I/O interfaces
PCIe4x PCIe Gen3
USB2x USB3.0, 8x USB2.0
SATA2x SATA 3.2
Video Interface
GPU Feature SupportIntel® Gen 12 UHD Graphics driven by Intel Xe architecture | OpenGL 4.6 OpenCL 3.0 | HW accelerated video decoding AVC/H.264/MPEG2/VP9/VC-1/WMV9G/MPEG, HEVC/H.265
HW accelerated video encode: AVC/H.264, MPEG2, HEVC/H.265/VP9/JPEG HDCP 1.4/2.2 content protection
Other Interfaces1x LPC, 1x I2C, 1x WDT, 1x SPI, 8x GPIO, 1x FAN control, 2x UART (TX/RX)
Embedded BIOS
Embedded BIOSAMI UEFI with Fast Boot support l Display Auto Detection l
Flash Update l Password Lock l OEM Logo for startup screen
Mechanical and Environmental
Form FactorPICMG COM.0 R3.1
COM Express Type 10 Mini Module
Dimension84 mm x 55 mm
Operating TemperatureIndustrial: -25°C to +85°C, w/ 0.5m/s airflow
Humidity0-95% RH, non-condensing
Power ManagementACPI 5.0 compliant
Power Input4.75V~20V
Operating System
Standard SupportMicrosoft® Windows 10 IOT
By project request: Yocto LTS kernel 2022

 

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