MOSM-M330E

NXP i.MX 93 family processor OSM module

Features

  • NXP i.MX 93 with quad core Arm® Cortex®-A55 processor
  • NPU with up to 0.5 TOPS
  • Onboard 2GB LPDDR4 memory and 16GB storage
  • Legacy I/O and high-speed interface
  • OSM v1.1 Size-L module specification
  • FTGA grid array with 662 contacts

The Open Standard Module™ specification allows developing, producing and distributing embedded modules for the most popular ARM and x86 architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

General
OSM Standard v1.1 Support OSM Size-L SoC module
CPU NXP i.MX 93 with Quad core Cortex-A55
Storage 16GB onboard eMMC 5.1 flash
32GB/64GB by project
Memory 2GB onboard LPDDR4, 3733 MT/s
Power Input 5V DC
Operating Systems Embedded Linux (Yocto-based)
I/O Interface
Audio 1x I2S
PCIe N/A
USB 4x USB2.0/ (1 port with OTG)
Display 1x 24bit LVDS single channel
1x MIPI DSI
Video 2D Graphic only
Camera 1x CSI 2-lane
Ethernet 2x GbE LAN (RGMII) (1 port with TSN)
Other Legacy I/O 14x GPIO, 2x I2C, 3x UART(2xRTS/CTS),
2x SPI, 2xCAN Bus, 2x SD card,
2x ADC, 1x PWM, 1x JTAG
Mechanical
Form Factor SGeT OSM Specification v1.1
OSM Size-L
662 pins
Dimension 45mm(L) x 45mm (W)
Environmental
Operating Temperature -40°C to 85°C
Relative Humidity 5 % to 95 % RH (non-condensing)