MOSM-M330E

NXP i.MX 93 family processor OSM module

Features

  • NXP i.MX 93 with quad core Arm® Cortex®-A55 processor
  • NPU with up to 0.5 TOPS
  • Onboard 2GB LPDDR4 memory and 16GB storage
  • Legacy I/O and high-speed interface
  • OSM v1.1 Size-L module specification
  • FTGA grid array with 662 contacts

The Open Standard Module™ specification allows developing, producing and distributing embedded modules for the most popular ARM and x86 architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

General
OSM Standard v1.1Support OSM Size-L SoC module
CPUNXP i.MX 93 with Quad core Cortex-A55
Storage16GB onboard eMMC 5.1 flash
32GB/64GB by project
Memory2GB onboard LPDDR4, 3733 MT/s
Power Input5V DC
Operating SystemsEmbedded Linux (Yocto-based)
I/O Interface
Audio1x I2S
PCIeN/A
USB4x USB2.0/ (1 port with OTG)
Display1x 24bit LVDS single channel
1x MIPI DSI
Video2D Graphic only
Camera1x CSI 2-lane
Ethernet2x GbE LAN (RGMII) (1 port with TSN)
Other Legacy I/O14x GPIO, 2x I2C, 3x UART(2xRTS/CTS),
2x SPI, 2xCAN Bus, 2x SD card,
2x ADC, 1x PWM, 1x JTAG
Mechanical
Form FactorSGeT OSM Specification v1.1
OSM Size-L
662 pins
Dimension45mm(L) x 45mm (W)
Environmental
Operating Temperature-40°C to 85°C
Relative Humidity5 % to 95 % RH (non-condensing)