MOSM-R221

OSM-L3.5” Evaluation Kit

Features

  • Open Standard module EVK with 662 pins
  • OSM LGA to Mini-ITX carrier board
  • Legacy I/O and high-speed interface implemented
  • Rich I/O & expansion boards support
  • 3.5” industrial form factor
  • 9-36V wide voltage input
The MOSM-R221 is a premier OSM-L Evaluation Kit (EVK) designed to significantly accelerate product development using OSM modules. Its centerpiece is a 3.5-inch industrial form factor carrier board that adapts the 662-pin OSM LGA module interface to a standard platform, such as Mini-ITX. The kit features comprehensive support for both legacy and high-speed interfaces. It provides developers with an ideal platform for rapid validation and deployment of OSM solutions in industrial AIoT applications.

General
OSM Standard v1.2 Support OSM Size-L SoC module
Power Input 9~36V power input
I/O Interface
Audio I2S with combo jack
PCIe 1x PCIe Gen3 with M.2 2230 Key E
USB 1x USB OTG(micro USB)
1x USB 3.0 Type-A
1x USB 3.0 Type-A
Display 1 ×MIPI-DSI (4-lane)
1 x DP
Expansion 1x eDP_Afor eDPor HDMI add-on card
2x GbE
1x LVDS connector
I2C 2x I2C
UART 1x UART to USB (console)
3x UART to header
1x UART to M.2 Key-E
PCIe 1x PCIe x1 to M.2 key-E 2242,
1x PCIe x1 to M.2 Key-M 2280,
1x PCIe x4 to M.2 Key-M(2280 support mSATA),
1x PCIex4 slot
Audio 1 x I2S(HDA) to header
1 x I2S(HDA) to M.2 Key-E
Expansion 2x M.2 Key-M 2280
1x M.2 Key-E 2242
1x SPI to Flash Socket
1x SPI to Header
1x mikro bus (UART, SPI).
2x CAN to header,
4xPWM to header, 1x JTAG to header, 2x ADC to header
Mechanical
Form Factor 3.5″
Dimension 146mm(L) x 102mm(W)
Environmental
Operating Temperature 0°C to 70°C
Storage Temperature -40°C to 85°C
Relative Humidity 5 % to 95 % RH (non-condensing)