June 2, 2026 | Taipei, Taiwan
MiTwell, a leading provider of advanced edge AI solutions, today announced the release of its new MSOM-R220-IQ9 3.5-inch evaluation carrier board. Powered by the Qualcomm Dragonwing™ IQ9 Series, the platform is designed to delivers up to 100 dense TOPS of AI inference performance, enabling the execution of complex deep learning models and high-performance video analytics at the edge.
The MSOM-R220-IQ9 brings the IQ9 module into a standard 3.5-inch form factor, tailored specifically for industrial-grade edge computing systems that demand high performance, rich I/O density, and a compact footprint. Its capabilities make it an ideal fit for forward-looking applications such as Autonomous Mobile Robots (AMRs), industrial Automated Optical Inspection (AOI), smart security surveillance, and Edge AI-enabled IoT deployments.
High-Density I/O Integration and Industrial-Grade Reliability
The MSOM-R220-IQ9 features key hardware advantages designed to meet the rigorous demands of industrial AI and robotics deployments:
Accelerating Next-Generation Edge Deployment
By integrating advanced edge AI compute capabilities and high-density sensor interfaces into an industry-standard 3.5-inch form factor, the MSOM-R220-IQ9 demonstrates significant design agility and innovation. This hardware integration directly enables system integrators to drastically shorten development cycles and accelerate the time-to-market for advanced robotics and complex industrial AI applications.
About MiTwell
MiTwell is a leading provider of industrial embedded computing solutions, delivering innovative hardware and design services for automation, AI, IoT, and edge applications. With a strong focus on quality, reliability, and scalability, MiTwell continues to drive digital transformation across industries worldwide.
For more information, visit: https://www.mitwell.com.tw/
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