Way to Solve the Thermal Issue

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The goal of thermal management is to keep components working within allowed operating temperature. Usually electronic components are the main source of heat flow, it generates temperature difference during thermal resistance paths (such as IC package, solder joint, chassis and heat sink), and as the temperature difference from the heat source IC to the external heat sink accumulates, the IC junction temperature (T_j) The relationship completed in relation to the ambient temperature (T_A) consists of the magnitude of the heat flow (Q), the total thermal resistance of the path (Θ) and the temperature difference (T_j-T_A). This path lays the foundation for solving the heat dissipation problem.

Thermal solution

The thermal parameters relationship can be expressed by the equation. Those terms of Q, Θ, T_j and T_A are reviewed in application aspect for designing a fitted thermal solution or solving thermal issue, including component grade, MTBF, operation environment, functionality, performance, ID, mechanical cost and constrain to size. The temperature difference term donates thermal budget for thermal solution. The larger the difference, the larger the budget, it can be used to mitigate the requirement toward heatsink.

The IPC thermal solution

The IPC thermal solution normally determined by its mechanical design, surface treating and airflow condition. For thermal design of a high-end IPC, the requirements for working in high-temperature environment or high-performance purpose, the fin area is needed for achieving the design goal of low thermal resistance and usually tuned via controlling the height. If compact design is required, another way is redefinition of airflow in an environment or the use of fan.

Once the heat sink, pads, PCB, and chassis that make up the thermal path from the inside to the outside can be approximated as a resistor network, the thermal problem can be analyzed, tuned, and resolved according to the above formula.

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