Knowledge sharing

CISC in OSM

OSM (Open Standard Module)</span

OSM is the smallest industry module standard. Currently, there are three main module form factors, SMARC, Qseven, and COM Express. The size based on OSM-L is 45mm x 45mm, which is only 49% of SMARC, 41% of Qseven and 22% of COM Express. This makes the biggest challenge in developing OSM modules to integrate the full functionality of CISC related chips into an OSM form factor, since CISC chips are typically larger than RISC.

Hardware advantages

Solderable OSM modules provide stamp-sized hardware layout placement and direct-on-board manufacturing. These hardware advantages of OSM allow customers to optimize the architecture of the system design and miniaturize the system form factor.

Optimize the
architectural system design

Miniaturize
the system form factor

Why customers choose CISC

Not only hardware development, but software resources are also the most important reason why customers choose CISC to build systems. CISC in OSM is an ideal concept with the smallest SoM (System on Modular) in industrial standard and the most popular software development environment. Through the relatively open software architecture, the software development time can be accelerated, the cost of development can be reduced, and a large number of package software can be provided.
Reduce
development cost
Provide
package software
Accelerate
development time

The main goal

Leveraging the CISC ecosystem is the main goal of OSM focusing on IoT products, which can link a wider range of system integration resources, shorten time-to-market and increase market acceptance.
Link a wider range of system resources
Shorten time-to-market
Increase market acceptance

The world's first CISC in OSM

Mitwell develops the world’s first OSM integrating CISC software and hardware and provides carrier boards and software packages for customers’ project implementation.