MOSM-MN30E-S

MOSM-MN30E-S

OSM-S with NXP i.MX 93 family processor

Features

NXP i.MX93, Dual-Core Arm® Cortex®A55+M33 processor
NPU with up to 0.5 TOPS
Onboard 2GB LPDDR4 memory and 16GB storage
Legacy I/O and high-speed interface
OSM standard v1.2, size-S (30x 30 mm), 332 pins

The MN30E-S module, with its 30×30 mm size, integrates the NXP i.MX 93 dual-core processor, providing efficient computing, offering an optimized solution for space-constrained embedded applications. Its built-in 0.5 TOPS NPU supports AI applications such as edge computing and IoT, enabling intelligent functionalities. Equipped with 2GB LPDDR4 memory, 16GB storage, and rich I/O interfaces, it is ideal for space-constrained embedded systems.

General
OSM Standard v1.2	Support OSM Size-S
CPU	NXP i.MX93, Dual-Core Arm® Cortex®A55+M33
Memory	2G onboard LPDDR4, 3733MT/s
Storage	16GB onboard eMMC 5.1 flash up to 64GB
Power input	5V DC
Operating System	Embedded Linux (Yocto distribution)
Basic I/O Interface
Audio	1x I2S
USB	2x USB2.0/ (1 port with OTG)
Display	1x MIPI DSI
Video	Integrated in CPU
Camera	1x MIPI-CSI (2 lanes)
Ethernet	2x GbE LAN (RGMII) (1 port with TSN)
Other Legacy I/O	8x GPIO, 2x I2C, 3x UART(2xRTS/CTS) 2x SPI, 2xCAN Bus, 2x SDIO 2x ADC, 2x PWM, 1x JTAG
Mechanical
Form Factor	SGeT OSM Specification v1.2 OSM size S 332 pins
Dimension	30mm(L) x 30mm (W)
Environmental
Operating Temperature	-20°C ~ 85°C
Humidity	5-95% RH, non-condensing

Module Solution

Embedded Systems

System Integration

Features

EDM

Datasheet

Accessories

Dimension

User’s Guide

Driver

PET tool

eAPI

Certification

Manual

Software API

3D Model

Driver-Graphics

Driver-Chipset

Driver-Serial IO

Driver-TxE

Driver-LAN

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MiTwell, Inc.

Module Solution

Embedded Systems

System Integration

Features

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