MOSM-M330E | Module Solution, OSM | 瑞利軍工 Advanced MiT Solution Provider

MOSM-M330E

NXP i.MX 93 family processor OSM module

Features

NXP i.MX 93 Plus with Dual Arm® Cortex®-A55 processor
NPU with up to 0.5 TOPS
Onboard 2GB LPDDR4 memory and 16GB storage
Legacy I/O and high-speed interface
Size L module, OSM v1.1

The Open Standard Module™ specification allows developing, producing and distributing embedded modules for the most popular ARM and x86 architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

General
CPU	NXP i.MX 93 with Dual core Cortex-A55
Memory	2G onboard LPDDR4, 3733MT/s
Storage	16GB onboard eMMC 5.1 flash 32GB/64GB by project
Power input	5C DC
Operating System	Embedded Linux (Yocto distribution)
Basic I/O Interface
Audio	1 x I2S
PCI Express	N/A
USB	4x USB2.0 / (1 port with OTG)
Display	1x 24bit LVDS single channel 1x MIPI DSI
Video	2D Graphic only
Camera	1x CSI 2-lane
Ethernet	2x GbE LAN (RGMII) (1 port with TSN)
Other Lagacy I/O	14x GPIO, 2x I2C, 3x UART(2xRTS/CTS) 2x SPI, 2xCAN Bus, 1x SD card 2x ADC, 1x PWM, 1x JTAG
Mechanical
Form Factor	SGeT OSM Specification v1.1 OSM size L 662 pins
Dimension	45 (L) x 45 (W) mm
Mechanical and Environmental
Operating Temperature	(-)20°C to +85°C
Humidity	5-95% RH, non-condensing