ARIS-TU

Advanced Reliable Industry System

Features

  • Support Intel® Edge Controls for Industrial
  • Tiger Lake-UP3
  • Compact IPC
  • Fan-less Chassis
  • Time Sensitive Network
  • Wide Voltage DC Input
ARIS is compact IPC implemented rich I/O for industry fields. Those I/O including high-speed communication and low data rate connection. Rugged and reliable system design supports the applications of edge computing and industrial control. Intel TCC and TSN are the functions in use under industrial real-time networking.

Mechanical
Dimension180(mm)x134(mm)x40(mm)
Weight1.5kg
HousingAluminum housing
Moumting typeWallmount and Dinrail
CoolingFanless, cooling with heatsink
IPIP30
General
CPUIntel® Core i® processors -i3 1115GRE /i5 1145GRE/i7 1185GRE Tiger Lake-U processors 15W based on Type6 Compact COM EXPRESS module.
Storage1x M.2 M Key 2280 NVMe (PCIe)
1x M.2 B Key 2242 SSD (SATA) (or 3042/3052 cellular module)
MemorySO-DIMM DDR4 up to 64GB, 3200 MT/s
Dual memory channels, 64bit with In-Band ECC
Power Input9~36V
Indicator LEDError :over heat (Red)  / throttling (orange)
EC ready : ready (green) / off
power : S0 (green) / S3.S4.S5 (off)
M.2 Storage : green / off
Operating SystemsWindows® 10 IoT Enterprise / Linux
Expansion1 x M.2 Key M 2242 (SATA)
Basic I/O Interface
Power Connection1 x 3-pin screw-type terminal block
Ethernet2x 2.5 GbE (Intel® i226) and 1x 2.5 GbE (MaxLinear® GPY215)
USB3x USB 3.2 and 3 USB 2.0
COM4x COM ports, 8x digital inputs and 8x digital outputs
Display2x DP v1.4 7680 x 4320 @ 60Hz
Expansion1x M.2 E Key 2230 Wi-Fi module
1x M.2 B Key 3042/3052 cellular module (or 2242 SATA SSD)
1x Mini PCIe slot (PCIex1)
Environment
Operating Temperature -25°C ~ 50 °C
Storage Temperature-40 °C ~ 85 °C
VibrationWall mount-  MIL-STD-810G 514.7C-V Category-4 / Din Rail – 1G (DIN EN 60068-2-6)
ShockWall mount – 40G (EN 60068-2-27)/ Din Rail – 15G (EN 60068-2-27)
CertificationCE, FCC